Xbox 360:Motherboard Information

Xenon

The motherboard used in beta XDKs and the finalized launch models. It has a 90nm CPU, GPU, and eDRAM.

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Elpis

Officially referbished Xenon with an 80nm GPU.

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Schematics

Refer to the Xenon schematics, as they are the same PCB.

Boardview

Refer to the final Xenon boardview, as they are the same PCB.

Zephyr

Relatively significant motherboard redesign while being cheaper to produce and supported HDMI. It first appeared in late 2006. The encoder/analog IC (Ana) and clock generator from the Xenon were integrated in a new HANA chip. The Zephyr B/C also feature CPUs with newer stepping and die shrunken 80nm Y2 and Rhea GPUs. The Zephyr_B's Y2 GPU still had a 90nm eDRAM, whereas the Zephyr_C's Rhea GPU shrunk the eDRAM to 80nm. The Zephyr_B first appeared in early 2007, but the Zephyr_C shortly followed around mid-2007.

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Zephyr_C

Falcon

First motherboard to feature a 65nm CPU while being slightly further simplified. It first appeared in late 2007 consoles. Mid-2008 and later Falcons also came with reliable Rhea GPUs and 4x128MB RAM configurations instead of the previous 8x64MB.

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Jasper

First motherboard to shink the GPU to 65nm, matching with the CPU. It was first seen in late 2008 consoles. It came with an updated south bridge that supported "big block" 256 MB and 512 MB NAND flash chips and those bigger flash chips were featured in the "Xbox 360 Arcade" retail configurations. Some Jasper motherboards produced in July 2009 also came with Kronos GPUs, which shrunk the eDRAM to also be 65nm. These motherboards first appeared in are known to be reliable.

Schematics

Includes "Panda" integrated memory unit, using an additional NAND + USB interface as opposed to the final Jasper solution combined with main NAND.

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Tonasket

Also known as "Jasper Kronos" or by the GPU name, "Kronos". It was first spotted in late 2009 consoles. It is a minor PCB revision of the Jasper, but all of the GPUs on this board are the Kronos revision with a 65nm eDRAM. All versions of this motherboard are also known to be reliable.

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Trinity

Significant motherboard redesign used for the launch models of the Xbox 360 S. It combines the CPU and GPU into one 45nm chip codenamed "Valhalla". The eDRAM is still 65nm. It has the same flash config as the Jasper & Tonasket and is generally quite reliable like the Jasper and Tonasket.

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Retail

Unpopulated

Corona

Also known as "Corona V1 (16MB)" or "Corona V2 (4 GB)"

First appeared in mid-2011 S consoles. It has similarities to Trinity, but slightly simplified and with a new south bridge that can support on-board 4 GB NANDs. The new south bridge also integrated the ethernet PHY and HANA IC into it. It is also reliable, aside from the 4 GB flash chips.

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Corona 4 GB

Waitsburg

Also known as "Corona V3 (16MB)" or "Corona V4 (4 GB)"

First appeared in early 2012 S consoles. POST trace has been removed. It's otherwise essentially the same as the Corona.

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Waitsburg 16 MB

Stingray

Also known as "Corona V5 (16MB)" or "Corona V6 (4 GB)"

Launch model Xbox 360 E motherboard. Very similar to Waitsburg but with a new power supply connector and less rear I/O.

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Stingray 4 GB

Winchester

Revised XCGPU and a vastly more simplified layout. The updated XCGPU integrated the eDRAM into the main die and patched the Reset Glitch Hack by disabling many of the pins used for that exploit. This motherboard first appeared in Xbox 360 Es in late 2014.

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Winchester 4 GB

No schematics or boardviews are currently available for this motherboard.

Schematic Notes

USB lines

Gameport

Front USB

Memport

Front USB (Memory Unit)

Expport

Rear USB (incl. Kinect)

Waveport

Xbox 360 S/E Wi-Fi card

MUport

Internal USB (Memory Unit for Trinity)

Argon

Front panel for original models

Boron

Front panel for Xbox 360 S models