Xbox 360:Motherboard Information

Original Model

Xenon

The motherboard used in beta XDKs and the finalized launch models. It has a 90 nm Waternoose CPU, 90 nm Y1 GPU, and 90 nm Edifis eDRAM. Commonly has leaky 16v 1500µF capacitors, leaky 6.3v capacitors, and unreliable GPUs. Some Xenons sent into Microsoft for RROD repair were either turned into an Elpis or received a revised 90 nm Y1 GPU with high Tg underfill.

Retail Xenons came with a 16 MB NAND flash chip, whereas non-retail consoles came with a 64 MB NAND flash.

Part Number: X803600

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Capactior Map

Elpis

Officially referbished Xenon with an Elpis GPU, which essentially a Rhea modified to work with a Xenon. These boards are known to be reliable, but still suffer from the Xenon's capacitor problem.

Part number is the same as the original Xenon.

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Schematics

Refer to the Xenon schematics, as they are the same PCB.

Boardview

Refer to the final Xenon boardview, as they are the same PCB.

Zephyr

Relatively significant motherboard redesign while being cheaper to manufacture and added HDMI support. It first appeared in late 2006. The encoder/analog IC (Ana) and clock generator from the Xenon were integrated in a new HANA chip. NAND Flash configuration is the same as the Xenon. The Zephyr B/C also feature CPUs with newer stepping and revised Y2/Rhea GPUs respectively. The Zephyr_B's Y2 GPU still had the original eDRAM but with a shrunken GPU die due to manufacturing optmizations, whereas the Zephyr_C's Rhea GPU had a redesigned eDRAM codenamed Stryx. The Zephyr_B first appeared in early 2007, but the Zephyr_C shortly followed around mid-2007.

Zephyr_A Part Number: X810385

Zephyr_B/C Part Number: X810387

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Zephyr_C

Falcon

First motherboard to feature a 65 nm Loki CPU while being slightly further simplified, like having a cheaper power delivery system (CPU Core voltage is two phases instead of three, for example). It first appeared in late 2007 consoles. Mid-2008 and later Falcons also came with reliable Rhea GPUs (came with a higher Tg underfill) and 4x128MB RAM configurations instead of the previous 8x64MB. The reliable GPUs were standardized in consoles made around June/July of 2008. NAND Flash configuration is the same as the Xenon and Zephyr.

There are also versions of this board called "Opus". They are essentially just Falcons but used as motherboard replacements for referbished Xenons. As such, they don't have an HDMI port. In fact, the AV port on the Opus was only used for it and is different from the Xenon's AV connector.

Part number: X812320

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Jasper

First motherboard to shink the GPU to the 65 nm Zeus, matching with the CPU. It was first seen in late 2008 consoles. It came with an updated south bridge that supported "big block" 256 MB and 512 MB NAND flash chips with a built in user accessible memory unit, and those bigger flash chips were featured in the "Xbox 360 Arcade" retail configurations. Non-retail developer consoles with Jasper motherboards still used 64 MB NAND chips. Some Jasper motherboards produced in July 2009 also came with Kronos GPUs, which shrunk the eDRAM to also be 65 nm. Some of these motherboards also came with an updated CB bootloader that patched the SMC (or "JTAG") Hack.

Most of these motherboards are known to be reliable, but some may come with leaky 16v 1500 µF Sanyo capacitors.

Part Number: X815842

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Schematics

Includes "Panda" integrated memory unit, using an additional NAND + USB interface as opposed to the final Jasper solution combined with main NAND.

Tonasket

Also known as "Jasper Kronos" or by the GPU name, "Kronos". It was first spotted in late 2009 consoles. It is a minor PCB revision of the Jasper, but all of the GPUs on this board are the Kronos revision with a shrunken 65 nm Stryx eDRAM. All versions of this motherboard are also known to be reliable. NAND flash configurations on the Tonasket are the same as the Jasper, except for the 256 MB config not being used anymore. All of these motherboards are patched against the SMC Hack.

This motherboard is usually referred to as the most reliable revision.

Part Number: X820379

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Schematics

Since the Tonasket is very similar to the Jasper, you can refer to the Jasper schematics.

Xbox 360 S

Trinity

Significant motherboard redesign used for the launch models of the Xbox 360 S. It combines the CPU and GPU into one 45 nm die while still using the 65 nm Styx EDRAM. The name of the new combied chip was Vejle, with the original codename being Valhalla. It has the same flash config as the Jasper & Tonasket and is generally quite reliable like the Jasper and Tonasket. Interestingly, non-retail developer consoles came with a "big block" 512 MB NAND instead of 64 MB. Some consoles came with an internal 4 GB Memory Unit add-on.

Part Number: X820379

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Retail

Unpopulated

Corona

Also known as "Corona V1 (16MB)" or "Corona V2 (4 GB)"

First appeared in mid-2011 S consoles. It has many similarities to Trinity, but slightly simplified with a new south bridge that can support on-board 4 GB NANDs. The new south bridge also integrated the ethernet PHY and HANA IC into it. It is also reliable, aside from the 4 GB flash chips.

Part Number: X857330

4 GB Build-up: X859085

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Corona 4 GB

Waitsburg

Also known as "Corona V3 (16MB)" or "Corona V4 (4 GB)"

First appeared in early 2012 S consoles. POST trace for the CPU has been removed. 4 GB versions of this board also came with a BGA eMMC intead of the Hynix TSOP NAND + Phison PS700 that was previously on the Corona. It's otherwise exactly the same as the Corona.

Part Number: X862605

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Waitsburg 16 MB

Schematics

Since the Waitsburg is very similar to the Corona, you can refer to its schematics.

Xbox 360 E

Stingray

Also known as "Corona V5 (16MB)" or "Corona V6 (4 GB)"

Launch model Xbox 360 E motherboard. Very similar to Waitsburg but has a single barrel power supply connector and less rear I/O. The ICs for tilt detection and front panel button chimes are also removed, but the pads are still present.

Part Number: X854326

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Stingray 4 GB

Schematics

Since the Stingray is very similar to the Corona, you can refer to its schematics.

Winchester

No schematics or boardviews are currently available for this motherboard.

Revised XCGPU and a vastly more simplified layout. The new Oban XCGPU integrated the eDRAM into the main die, shrunk the manufacturing process to 32 nm, and patched the "Reset Glitch Hack" by disabling many of the pins used for that exploit. This motherboard first appeared in Xbox 360 Es in late 2014.

Part Number: X879957

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Winchester 4 GB

Schematic Notes

USB lines

Gameport

Front USB

Memport

Front USB (Memory Unit)

Expport

Rear USB (incl. Kinect)

Waveport

Xbox 360 S/E Wi-Fi card

MUport

Internal USB (Memory Unit for Trinity)

Argon

RF module for original models

Boron

RF module for Xbox 360 S models